Technical Program Committee
A-SSCC 2018 Technical Program Committee Chairs
Technical Program Chair:
Hong-June Park, POSTECH
Technical Program Co-Chair:
Mototsugu Hamada, Keio University
Technical Program Vice-Chair:
Jae-Yoon Sim, POSTECH
Technical Program Vice-Co-Chair:
Jun Deguchi, Toshiba Memory
Regular Technical Sub-committee Chairs
Analog Circuits & Systems:
Hidetoshi Onodera, Kyoto University
Data Converter:
Seng-Pan (Ben) U, University of Macau
Digital Circuits & Systems:
Robert Chen-Hao Chang, National Chung Hsing University
Emerging Technologies and Applications:
Woogeun Rhee, Tsinghua University
Memory:
Junghwan Choi, Samsung Electronics
Radio Frequency:
Satoshi Tanaka, Murata Manufacturing
SoC & Signal Processing Systems:
Kazutami Arimoto, Okayama Prefectural University
Wireline Communications:
Chulwoo Kim, Korea University
Special Sessions Chairs
Student Design Contest Co-Chair:
Baoyong Chi, Tsinghua University
Student Design Contest Co-Chair:
Jung-Hoon Chun, Sungkyunkwan University
Industry Program Chair:
Stefan Rusu, TSMC North America
FPGA Ad-Hoc Co-Chair:
Shigeki Tomishima, Intel
Educational Program Co-Chair:
Hoi-Jun Yoo, Korea Advanced Institute of Science & Technology
Educational Program Co-Chair:
Byeong-Gyu Nam, Chungnam National University
Invited Program Chair:
Hoi-Jun Yoo, Korea Advanced Institute of Science & Technology
Technical Program Committee Members
Analog Circuits and Systems
Chair:
Hidetoshi Onodera, Kyoto University
Hao Yu, Southern University of Science and Technology
Sai-Weng Sin, University of Macau
Li Geng, Xi'an Jiaoton University
Tetsuya Hirose, Kobe University
Po-Chiun Huang, National Tsing Hua University
Takeshi Ueno, Toshiba Corporation
Hyun-Sik Kim, Dankook University
Po-Hung Chen, National Chiao Tung University
Ji-Yong Um, Hannam University
Tzu-Ming Wang, Global Mixed-mode Technology
Data Converters
Chair:
Seng-Pan (Ben) U, University of Macau
Seung-Tak Ryu, Korea Advanced Institute of Science and Technology
Jong-woo Lee, Samsung Electronics
Yan (Julia) Zhu, University of Macau
Liyuan Liu, Chinese Academy of Sciences
Yung-Yu Lin, Mediatek
Tsung-Heng Tsai, National Chung Cheng University
Jintae Kim, Konkuk University
Sanroku Tsukamoto, Fujitsu Laboratories Ltd.
Chih-Cheng Hsieh, National Tsing Hua University
Zule Xu, University of Tokyo
Digital Circuits and Systems
Chair:
Robert Chen-Hao Chang, National Chung Hsing University
Tay-Jyi Lin, National Chung Cheng University
Byungsub Kim, POSTECH
Leibo Liu, Tsinghua University
Keiichi Kushida, Toshiba Memory Corporation
Jun Zhou, University of Electronic Science and Technology of China
Xiaoyang Zeng, Fudan University
Mototsugu Hamada, Keio University
Yoonmyung Lee, Sungkyunkwan University
Massimo Alioto, National University of Singapore
Koyo Nitta, Nippon Telegraph and Telephone Corporation
Shouyi Yin, Tsinghua University
Emerging Technologies and Applications
Chair:
Woogeun Rhee, Tsinghua University
Jerald Yoo, National University of Singapore
Jun Deguchi, Toshiba Memory Corporation
Minkyu Je, Korea Advanced Institute of Science and Technology
Youngcheol Chae, Yonsei University
Nan Sun, University of Texas at Austin
Shuenn-Yuh Lee, National Cheng-Kung University
Zhichao Tan, Analog Devices Inc.
Chao Wang, Singapore University of Technology and Design
Shiro Dosho, Tokyo Institute of Technology
Noriyuki Miura, Kobe University
Ping-Hsuan Hsieh, National Tsing Hua University
Memory
Chair:
Junghwan Choi, Samsung Electronics
Hung Jen Liao, TSMC
Atsushi Kawasumi, Toshiba Memory Corporation
Kazutaka Miyano, Micron
Chun Shiah, Etron
Meng-Fan Chang, National Tsing Hua University
Ken Takeuchi, Chuo University
Hwang Hur, SK Hynix
Tony T. Kim, Nanyang Technological University
Ik Joon Chang, Kyunghee University
Jun Yang, Southeast University
Shyh-Shyuan Sheu, Yuan Ze University
Radio Frequency
Chair:
Satoshi Tanaka, Murata Manufacturing
Minjae Lee, Gwangju Institute of Science and Technology
Huei Wang, National Taiwan University
Minoru Fujishima, Hiroshima University
Chien-Nan Kuo, National Chao Tung University
Baoyong Chi, Tsinghua University
Davide Guermandi, IMEC
Tae Wook Kim, Yonsei University
Kai Kang, University of Electronic Science and Technology of China
Taizo Yamawaki, Hitachi
Bo Zhao, Zhejiang University
SoC and Signal Processing Systems
Chair:
Kazutami Arimoto, Okayama Prefectural University
Byeong-Gyu Nam, Chungnam National University
Satoshi Shigematsu, NTT Microsystem Integration Laboratories
Yong Hei, Chinese Academy of Sciences
Chun Zhang, Tsinghua University
Pei-Yun Tsai, National Central University
Tsung-Te Liu, National Taiwan University
Shigeki Tomishima, Intel
Ji-Hoon Kim, Ewha Womans University
Daisuke Mizoguchi, Renesas
Hsi-Pin Ma, National Tsing Hua University
Wireline Communications
Chair:
Chulwoo Kim, Korea University
Wei-Zen Chen, National Chiao Tung University
Jun Terada, NTT
Jung-Hoon Chun, Sungkyunkwan University
Yasufumi Sakai, Fujitsu Laboratories Ltd.
Ching-Yuan Yang, National Chung‐Hsing University
Ziqiang Wang, Tsinghua University
Patrick Yin Chiang, Fudan University
Young-Chan Jang, Kumoh National Institute of Technology
Koichi Yamaguchi, Intel
Masum Hossain, University of Alberta
Industry
Chair:
Stefan Rusu, TSMC North America
Toru Shimizu, Toyo University
Kazuko Nishimura, Panasonic
Daisaburo Takashima, Toshiba
ShaoJun Wei, Tsinghua University
Ting Wu, Norel Systems
Fan Yung Ma, Infineon
Surhud Khare, Intel
Masaitsu Nakajima, Socionext
